 Prodotti> Substrat taċ-ċeramika> Substrat taċ-ċeramika metallizzat> DCB / DBC Ceramic Substrat Direct Copper Bonding

DCB / DBC Ceramic Substrat Direct Copper Bonding

$1-100 /Piece/Pieces

Kuntatt Issa

Tip ta 'Ħlas: T/T,Paypal,L/C,Western Union,Money Gram,Credit card
Incoterm: FOB,CIF,EXW,FCA,DDP,DDU
Min. Ordni: 100 Piece/Pieces
Trasport: Ocean,Land,Air,Express
Port: Shenzhen

Abbiltà tal-Provvista u Informazzjonijiet Addizzjonali

Additional Information

Imballaġġ: Ippakkjar bil-vakwu

Trasport: Ocean,Land,Air,Express

Post ta 'Oriġini: Iċ-Ċina

Ċertifikat: RoHS

Kodiċi HS: 8547100000

Port: Shenzhen

Tip ta 'Ħlas: T/T,Paypal,L/C,Western Union,Money Gram,Credit card

Incoterm: FOB,CIF,EXW,FCA,DDP,DDU

Attributi tal-Prodott

Mudell Nru.: Customized

Brand: Ċeramika Jinghui

Place Of Origin: China

Species: Ceramic Plates

Application: Industrial Ceramic

Finished Product: Ceramic Circuit Board

Substrate Material: 96%, 99.6% Alumina

Surface Metallization Process: Direct Bonded Copper ( DCB / DBC) Technology

Feature: Strong Bonding Strength between Ceramic and Metal

Usage: To Realize Electrical Connections

Ippakkjar u Kunsinna

Unitajiet tal-Bejgħ:	Piece/Pieces
Tip ta' Pakkett:	Ippakkjar bil-vakwu

Deskrizzjoni tal-prodott

DCB / DBC Ceramic Substrat Direct Copper Bonding Prinċipju ta 'sottostrat taċ-ċeramika tad-DBC tar-ram marbut dirett L-ossiġenu huwa miżjud bejn ir-ram u ċ-ċeramika biex jinkiseb likwidu eutettiku Cu-o f'temperatura ta '1065-1083 ° C, u mbagħad jirreaġixxi biex tinkiseb fażi intermedja (CUAIO2 jew CUAI2O4), u b'hekk tirrealizza t-twaħħil tal-metallurġija kimika bejn is-saff Cu u ċ-ċeramika vojta Sottostrat li huwa magħmul regolarment minn ċeramika tal-alumina,...

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Category: Substrat taċ-ċeramika metallizzat

 Prodotti> Substrat taċ-ċeramika> Substrat taċ-ċeramika metallizzat> DCB / DBC Ceramic Substrat Direct Copper Bonding